L200C太陽能硅片濃縮切削液,L200C硅片切削液
L200C Cutting Fluid Conc. for Silicon Ingot Bricking/Squaring / Cropping
用于硅錠切塊/破方/修整的L200C濃縮切削液

Application: Diamond wire & Band saw processes
用途：金剛石線鋸和帶鋸流程

L200C lubricant Series is a biodegradable water based, non caustic material
L200C太陽能硅片切削液用于太陽能硅片的多線切割
系列潤滑劑是一種可生物降解、水性、非堿性物質(zhì)

Dilution ratio of DI /RO water: Cutting Fluid - 50:1  to  80:1
去離子水/反滲透水溶液比例:切削液 - 50:1至80:1

Excellent wetting and rinsing properties 
極好的濕潤和沖洗功能

Increases heat transfer (heat dissipation) hence reduces heat buildup and thermal stress
可以加快傳熱(散熱)速度，減少生熱和熱應(yīng)力

High speed water surface tension reducer
迅速降低水表面張力

Prevents silicon dust (swarf) agglomeration, allowing for easier cutting
防止硅塵(硅屑)堆積，更加容易切削

濃縮切削液 藍寶石切削液 晶體切削液 切削液
本產(chǎn)品溶解比例高，在線割過程中帶走熱量、降低金鋼線熱量，延長金鋼線的使用壽命。